1. Printed circuit board (PCB) Industry
Especially high-priced version of the multi-layer PCB. The system can be used as product manufacturing process of the production line yield monitoring, production line end of line product quality inspection, product defect analysis, parts jack, and through-hole drilling positioning holes prior to positioning applications.
2. Ball Array (BGA) packages of welding and assembly of IC
BGA package IC package IC for the future of the mainstream, the use of class IC of the circuit boards of high-end, mostly high-priced products. The system can be applied to BGA package IC assembly of circuit boards in the right place, assembly solder joint yield after testing, solder joint defect analysis, three-dimensional solder joint shape analysis applications.
3. Small Precision Metal Casting Industry
The industry's products are used in high-priced electronic products, and military regulations livelihood products, these products are mostly close-type casting, required less follow-up processing. The product can be applied to the internal of the casting defect analysis, mechanical stress analysis and post-processing of the defect analysis. Casting can also be applied to adjust the conditions prior to casting and casting process, casting conditions, whether it's appropriate monitoring. This product can provide real-time analysis, it can reduce the bias due to casting conditions resulting from the loss of materials during the period. Regulations for the Army products, can provide quick and accurate analysis of the defects in order to cope with such products as high-density sampling requirements.
4. Passive electronic components industry
The products of the industry volume, lower unit costs. But because a large quantity of the detection limit can be derived from the concept of so rapid and real-time detection-based products used in this industry advantages.
5.IC packaging industry
This product is applicable to all integrated circuit package, the internal weld line after position, solder joint shapes, connection status, etc. of the test. The use of real-time imaging capabilities of this product provides full product testing.
6. Small packaged goods inspection
Used in packaging may cause the user intervention in the material injury to the products. Such as pharmaceutical packaging, cosmetic packaging. Applies to general cargo security screening can detect abnormal contents, such as explosives, knives and other dangerous goods, application of this product and a small size of features on mobile can be used for body building items of mail security. These characteristics can also be applied to the inspection of suspected explosives.
7. Academic research and animal testing
This product can be applied to drug development and medical equipment, when carried out by the development of animal testing. Cereal crops, fruit of the internal analysis.
8. Other
This product is characterized by the mobility of a bad detection of non-penetrating features a very wide range of applications. All of these functions can be applied to other industries are the potential can be developed with customers.